Thermal Paste High Performance to maximize the heat transfer from processor to Heatsink. The high viscosity formula efficiently fills invisible imperfections of the surface improving the contact and the thermal conductivity. Main specifications Thermal Conductivity: > 1.22 W/m-K Thermal Resistance: < 0.201 °C-in²/W Package: 1 g syringe syringe design, for easy operation. High conductivity, low bleed, stable at high temperatures. Type: Silicone Fluid with 20% Metal Oxide. Dielectric Breakdown: > 5.0 KV ac. Color: White. Suitable for CPU GPU, VGA. Non-toxic, tasteless, non-corrosive. Net Weight: 1 g
