---
product_id: 14224147
title: "Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling 2012th Edition"
brand: "yong liu"
price: "NT$14056"
currency: TWD
in_stock: false
reviews_count: 1
category: "Books"
url: https://www.desertcart.tw/products/14224147-power-electronic-packaging-design-assembly-process-reliability-and-modeling-2012th
store_origin: TW
region: Taiwan
---

# Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling 2012th Edition

**Brand:** yong liu
**Price:** NT$14056
**Availability:** ❌ Out of Stock

## Quick Answers

- **What is this?** Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling 2012th Edition by yong liu
- **How much does it cost?** NT$14056 with free shipping
- **Is it available?** Currently out of stock
- **Where can I buy it?** [www.desertcart.tw](https://www.desertcart.tw/products/14224147-power-electronic-packaging-design-assembly-process-reliability-and-modeling-2012th)

## Best For

- yong liu enthusiasts

## Why This Product

- Trusted yong liu brand quality
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## Description

From the Back Cover
        	
        	
        		
        		
	        		
						
			        		Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices.
						    	
					    	
						
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## Customer Reviews

### ⭐⭐⭐⭐⭐ Five Stars
*by N***N on June 1, 2017*

Excellent

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*Product available on Desertcart Taiwan*
*Store origin: TW*
*Last updated: 2026-05-06*